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DATA SHEET
PD16855A/B/C/D
DUAL HIGH-SIDE SWITCH FOR USB APPLICATION
MOS INTEGRATED CIRCUIT
DESCRIPTION
This product is the power switch IC with over current limit, used for the power supply bus of the Universal-SerialBus (USB). 2 circuit builds in the Pch power MOSFET in the switch part, and this product realizes low on resistance (100 m TYP.) respectively. And the over current detection, the thermal-shutdown circuit, an under voltage locked-out (UVLO) circuit whose functions are necessary in the Host/HUB-controller of the USB standard are built in. And the over-current-detect result can be reported to the controller by flag-pin. This product builds in each two circuits of the power switch, control-pins and flag-pins, and this IC can be able to control the power supply bus in 2 USB port. There are four kinds of this product by the input logic of the control signal and switch operation in over-current detect.
FEATURES
* Pch power MOSFET, 2 circuit building in * Over-current detection circuit is built in and its result is outputted from flag-pin ("L" active) * Prevent from dropping power supply by over current limit circuit * Thermal shutdown circuit building in * Under Voltage Locked Out (UVLO) circuit building in * Switch on/off control is possible by the control-pin. * 8 pin DIP/SOP package
ORDERING INFORMATION
PART NO. PACKAGE 8-pin plastic DIP (300mil) 8-pin plastic SOP (225mil) 8-pin plastic SOP (225mil) 8-pin plastic SOP (225mil) 8-pin plastic SOP (225mil)
PD16855BC PD16855AG PD16855BG PD16855CG PD16855DG
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. S13020EJ1V0DS00 (1st edition) Date Published February 1999 N CP(K) Printed in Japan
(c)
1998
PD16855
BLOCK DIAGRAM
IN (Input) 7
OUT1 8 (Output1)
5
OUT2 (Output2)
Ref. Voltage Over Current Detect Gate Control Gate Control
Ref. Voltage Over Current Detect
FLG1 2 (Flag Out1)
UVLO
3
FLG2 (Flag Out2)
Thermal Shutdown
6 GND
1 CTL1 (Control Input1)
4 CTL2 (Control Input2)
Note The internal resister doesn't connect to input terminal of CTL1 (1 pin) and CTL2 (4 pin). Therefore the input level must be "H" or "L" even if these pins aren't used.
2
Data Sheet S13020EJ1V0DS00
PD16855
CONNECTION DIAGRAM (TOP VIEW)
CTL1 FLG1 FLG2 CTL2
1 2 3 4
8 7 6 5
OUT1 IN GND OUT2
8-Pin DIP/SOP
PIN CONFIGURATION
PIN No. 1/4 2/3 6 7 8/5 SYMBOL CTL1/CTL2 FLG1/FLG2 GND IN OUT1/OUT2 I/O Input Output Power Power (Input) Output Control : TTL Input Over Current Detect Flag : Active-L, Nch open-drain Ground Power Supply : Source of MOSFET Output of Switch : Drain of MOSFET FUNCTION
DESCRIPTION of PD16855A/B/C/D FUNCTION
Abstract of Function PART No. CTL Input Logic Switch Operation with Over-Current Detect Over-Current Limit Operation. Switch Off with CTL Input "L" Over-Current Limit Operation. Switch Off with CTL Input "H" Switch Off regardless of CTL Input
PD16855AG PD16855BC/BG PD16855CG PD16855DG
"H" active "L" active "H" active "L" active
Data Sheet S13020EJ1V0DS00
3
PD16855
PIN CONFIGURATION (H:Hi-level, L:Low-level, ON:output ON state, OFF:output OFF state, X:H or L)
PD16855AG (Active-H)
CTL1 H H L L H H X X FLG1 H H H H L H L L OUT1 ON ON OFF OFF ON ON OFF OFF CTL2 H L H L H H X X FLG2 H H H H H L L L OUT2 ON OFF ON OFF ON ON OFF OFF normal mode only OUT1 is ON only OUT2 is ON standby mode only OUT1 is over-current detect only OUT2 is over-current detect TSD mode UVLO mode Operating mode
PD16855BC/BG (Active-L)
CTL1 L L H H L L X X FLG1 H H H H L H L L OUT1 ON ON OFF OFF ON ON OFF OFF CTL2 L H L H L L X X FLG2 H H H H H L L L OUT2 ON OFF ON OFF ON ON OFF OFF normal mode only OUT1 is ON only OUT2 is ON standby mode only OUT1 is over-current detect only OUT2 is over-current detect TSD mode UVLO mode Operating mode
4
Data Sheet S13020EJ1V0DS00
PD16855
PD16855CG (Active-H and Switch off with over-current detect)
CTL1 H H L L H H X X FLG1 H H H H L H L L OUT1 ON ON OFF OFF OFF ON OFF OFF CTL2 H L H L H H X X FLG2 H H H H H L L L OUT2 ON OFF ON OFF ON OFF OFF OFF normal mode only OUT1 is ON only OUT2 is ON standby mode only OUT1 is over-current detect only OUT2 is over-current detect TSD mode UVLO mode Operating mode
PD16855DG (Active-L and Switch off with over-current detect)
CTL1 L L H H L L X X FLG1 H H H H L H L L OUT1 ON ON OFF OFF OFF ON OFF OFF CTL2 L H L H L L X X FLG2 H H H H H L L L OUT2 ON OFF ON OFF ON OFF OFF OFF normal mode only OUT1 is ON only OUT2 is ON standby mode only OUT1 is over-current detect only OUT2 is over-current detect TSD mode UVLO mode Operating mode
Data Sheet S13020EJ1V0DS00
5
PD16855
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
Parameter Input Voltage Flag Voltage Flag Current Output Voltage Output Current Symbol VIN VFLG IFLG VOUT IOUT DC Pulse Width 100s Single Pulse Control Input Voltage Power Dissipation DIP SOP Operating Temperature Range Channel Temperature Range Storage Temperature Range TA TCH MAX Tstg VCTL PD Conditions Ratings -0.3 to +6 -0.3 to +6 50 VIN + 0.3 +0.5(VIN = VCTL =5 V) -0.1 (VIN = 0V, VOUT = 5V) +3 Unit V V mA V A
-0.3 to +6 400 300 -40 to +85 +150 -55 to +150
V mW
C C C
Note The thermal shutdown circuit (operating temperature is more than 150 C typ.) builds in this product.
RECOMMENDED OPERATING RANGE
Parameter Input Voltage Operating Temperature Range Symbol VIN TA Min +4 0 Typ Max +5.5 +70 Unit V C
6
Data Sheet S13020EJ1V0DS00
PD16855
ELECTRICAL CHARACTERISTICS DC CHARACTERISTICS (Unless otherwise specified, VIN = +5V; TA = +25C)
Parameter Circuit Current (only PD16855A/C) Symbol IDD Conditions VCTL = 0V (both 1 pin & 4 pin), OUT = open VCTL = VIN, OUT = open Circuit Current (only PD16855B/D) IDD VCTL = VIN (both 1 pin & 4 pin), OUT = open VCTL = 0V, OUT = open Low-level Input Voltage High-level Input Voltage Input Current of CTL pin VIL VIH ICTL CTL Pin CTL Pin VCTL = 0V VCTL = VIN Output MOSFET On Resistance RON TA = 0 to +70 C, IOUT = 500 mA DIP SOP 2.0 0.01 0.01 100 100 1 1 140 130 10 TA = 0 to +70 C IL = 10 mA VFLAG = 5 V VIN : Up VIN : Down Hysteresis 3.2 3.0 0.1 0.6 0.9 10 0.01 3.5 3.3 0.2 1.25 25 1 3.7 3.5 0.3 Min Typ 1 Max 5 Unit
A
mA
1 1
1.5 5
A
mA V V
1
1.5 1.0
A A
m
Output Leak Current Over Current Detect Threshold Flag Output Resistance Flag Leak Current Operating Voltage of Under Voltage Locked Out Circuit
IO LEAK ITH RON F IO LEAK F VUVLO
A
A
A
V V V
AC CHARACTERISTICS (Unless otherwise specified, VIN = +5 V; TA = +25 C)
Parameter Output Transition Rising Time Output Transition Falling Time Over Current Detect Delay Time CTL Input Low-Level Time (only PD16855A/C) CTL Input High-Level Time (only PD16855B/D) Symbol tRISE Conditions RL = 10 each output RL = 10 each output Min 2.5 Typ Max 12 Unit ms
tFALL
10
s s s s
tOVER
5
20
tCTL
CTL : HLH
20
tCTL
CTL : LHL
20
Data Sheet S13020EJ1V0DS00
7
PD16855
MEASUREMENT POINT
Output Transition Rising Time (at ON)/Output Transition Falling Time (at OFF) at the timing of CTL changing "L" to "H"/"H" to "L" for PD16855A/C
5 V/3.3 V CTL 10% 0V tRISE tFALL 5V VOUT 0V 90% 90% 10%
at the timing of CTL changing "H" to "L"/"L" to "H" for PD16855A/C
5 V/3.3 V CTL 0V tRISE 5V VOUT 0V 90%
tFALL 90% 90% 10%
8
Data Sheet S13020EJ1V0DS00
PD16855
Over Current Detect Delay Time/CTL Input Low-Level Time for PD16855A/C
IOUT
ITH
VOUT
PD16855A
tOVER
PD16855C
FLG 90%
tCTL CTL 90% 90%
Over Current Detect Delay Time/CTL Input High-Level Time for PD16855B/D
IOUT
ITH
VOUT
PD16855B
tOVER
PD16855D
FLG 90%
tCTL CTL 10% 10%
Data Sheet S13020EJ1V0DS00
9
PD16855
FUNCTION DESCRIPTION
1. Over current detection The specification of over current detect is 0.6 to 1.25 A (typ. 900mA) in this IC. (500 mA max. in USB standard) This function is that flag-pin turns to Low-level and reports to the USB controller when over current is detected. At this time, output of IC is operated as followed. * PD16855A/B : Output keep ON-state and over current limited circuit is operated. This function can be prevented from being long-time over current state. * PD16855C/D : Output turns to off, and isn't based on the state of CTL-pin. When CTL-pin turns to non-active, FLG-pin returns to High-level and Output-pin turn to OFF-state. Immediately the controller should be inputted non-active level to CTL-pin after detecting FLG = "L" not to reach to the state of thermal shutdown. Then, in the case of FLG-pin is High-level and CTL-pin is active level, Output-pin turns to ON-state. To prevent from detecting wrongly the current to the moment, over current detect delay time is set up. This delay time is 10 s (typ.). Power consumption in this device increases rapidly at the time of current-limitter circuit operation, and channel temperature Tch is likely to escalate. Make a CTL signal non-active, and make switch turn off before Tch of this device exceed absolute maximum rating.
Normal Mode 5V Flg 0V Vout Instant Switch off ( PD16855C/D) Over current detect threshold Iout 0A more than 10 s (typ.) Controlled by CTL-pin ( PD16855A/B)
in case of current surge 5V Flg 0V IN 1 A~ Iout 0.5 A less then 10 s (typ.)
PD16855
connection to the moment, it flow the large current
USB Device
OUT +
10
Data Sheet S13020EJ1V0DS00
PD16855
2. Under Voltage Locked Out (UVLO) Circuit UVLO is the circuit for preventing malfunction of the switch by voltage variation. In the Power Up : less than 3.5 V (typ.) and in the Power Down : less than 3.3 V (typ.) OUT : OFF FLG : "L" ( = 0V)
5V
Output
3.3 V 3.5 V Input
5V
3. Behavior in the case of Power ON This IC is slowly started up by Soft-Start Operation when IC is powered on. This function is to prevent from flowing large current in the period of charging the capacitor which is connected to Output-pin. In Power ON state, Soft-Start Time is 5ms (typ.)
5V Vin 0V 2.5 ms min. 12 ms max. 5V VOUT 0V 10 s max.
Data Sheet S13020EJ1V0DS00
11
PD16855
OPERATING SEQUENCE
Power On/Power Off
5V IN (input) GND 5V OUT (output) GND 5V Flg (output) GND 5V
PD16855A/C
CTL (input)
GND 5V
PD16855B/D
GND
over current detect threshold
Iout
Note If CTL-pin is active level after IC is powered on, This IC's Output is started Soft-Start Operation (Output Transition Rising Time : 12ms max.). When Power-voltage is less than UVLO operating voltage, FLG-pin is fixed on Low-Level. If CTL1 and CTL2 pins are non-active level, this IC moves to Stand-by mode (IDD = 5 A max.) Input controlled-signal
5V IN (input) GND 5V OUT (output) GND 5V GND 5V
Flg (output)
PD16855A/C
CTL (input) GND 5V
PD16855B/D
GND
12
Data Sheet S13020EJ1V0DS00
PD16855
Over current detect
PD16855A/B
5V IN (input) 5V Flg (output) GND 5V GND 5V GND GND 5V OUT (output) GND
over current detect threshold
PD16855A
CTL (input)
PD16855B
Iout
over current detect
PD16855C/D
5V IN (input) GND 5V GND 5V GND 5V GND 5V OUT (output) GND
over current detect threshold
Flg (output)
PD16855C
CTL (input)
PD16855D
Iout
over current detect
Note If Over current detect circuit is operated, FLG-pin is Low-Level and over current limit circuit is operated. At this time, output's operation is as followed.
PD16855A/B : output is OFF and Flg-pin is High-Level when CTL-pin is non-active level. PD16855C/D : output synchronizes in Flg-pin = "L", and is OFF.
Flg-pin is High-Level when CTL-pin is non-active level. And then when CTL-pin turns to active level again, if UVLO and TSD are not operated, Output-pin is reset to ON-state.
Data Sheet S13020EJ1V0DS00
13
PD16855
Thermal shutdown
5V IN (input) GND 5V OUT (output) GND 5V GND 5V GND 5V GND not Stand-by Stand-by
Flg (output)
PD16855A/C
CTL (input)
PD16855B/D
Tch
Thermal shutdown operating temperature (up)
Thermal shutdown operating temperature (down)
Note In operating the thermal shutdown, the status of output-pin is OFF. In this case, however, if CTL-pin is kept non-active level, this IC isn't in stand-by mode. And, thermal shutdown circuit can not be operated in both CTL1-pin and CTL2-pin are non-active level (equal to stand-by mode), if junction-temperature of this IC exceed 150 degree (typ.).
14
Data Sheet S13020EJ1V0DS00
PD16855
CHARACTERISTICS CURVES (unless otherwise specified, TA = 25 C, VIN = 5 V) (Nominal)
PT - TA Rating
500
Total Power Dissipation PT (mW)
DIP 400 SOP 300
200
100
0 -40
0
40 80 120 Ambient Temperature TA (C)
160
200
RON - TA Characteristics Note
140
On Resistance RON () On Resistance RON ()
RON - VIN Characteristics Note
140 120 100 80 60 40 20 0 3.5 4 4.5 5 5.5 6
120 100 80 60 40 20 0 -20 0 20 40 60 80
Ambient Temperature TA (C)
Ambient Temperature VIN (V)
IDD - TA Characteristics
1.0
Current Consumption IDD (mA)
IDD - VIN Characteristics
1.0
Current Consumption IDD (mA)
0.8 0.6 0.4 0.2 0.0 -20
0.8 0.6 0.4 0.2 0.0 3.5
0
20
40
60
80
4
4.5
5
5.5
6
Ambient Temperature TA (C)
Power Supply VIN (V)
IDD STB - TA Characteristics
Current Consumption IDD STB ( A) Current Consumption IDD STB ( A)
IDD STB - VIN Characteristics
0.10 0.08 0.06 0.04 0.02 0.00 3.5
0.10 0.08 0.06 0.04 0.02 0.00 -20
0
20
40
60
80
4
4.5
5
5.5
6
Ambient Temperature TA (C)
Power Supply VIN (V)
Note RON -TA Characteristics and RON - VIN Characteristics show the characteristics for SOP Package.
Data Sheet S13020EJ1V0DS00
15
PD16855
CHARACTERISTICS CURVES (unless otherwise specified, TA = 25 C, VIN = 5 V) (Nominal)
VIL - TA Characteristics
Low Level Input Voltage VIL (V) Low Level Input Voltage VIL (V)
VIL - VIN Characteristics
3.0 2.5 2.0 1.5 1.0 0.5 0.0 3.5 4.0 4.5 5.0 5.5 6.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80
Ambient Temperature TA (C)
Power Supply VIN (V)
VIH - TA Characteristics
3.0
High Level Input Voltage VIH (V)
VIH - VIN Characteristics
3.0
Low Level Input Voltage VIL (V)
2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80
2.5 2.0 1.5 1.0 0.5 0.0 3.5 4.0 4.5 5.0 5.5 6.0
Ambient Temperature TA (C)
Power Supply VIN (V)
ITH - TA Characteristics
Over Current Detect Curent ITH (A) Over Current Detect Curent ITH (A)
ITH - VIN Characteristics
1.2 1.1 1.0 0.9 0.8 0.7 0.6 -20 0 20 40 60 80
1.2 1.1 1.0 0.9 0.8 0.7 0.6 3.5 4.0 4.5 5.0 5.5 6.0
Ambient Temperature TA (C)
Power Supply VIN (V)
16
Data Sheet S13020EJ1V0DS00
PD16855
CHARACTERISTICS CURVES (unless otherwise specified, TA = 25 C, VIN = 5 V) (Nominal)
Output Transition Rising Time Output Transition Falling Time
Input Voltage 5 5
Voltage (V)
Voltage (V)
4 3 2 Output Voltage 1 0
4 Output Voltage 3 2 1 0
0
1
2 Time (ms)
3
4
0
0.4 Time ( s)
0.8
1.2
UVLO circuit operating voltage Characteristics
4.0
UVLO Operating Voltage VUVLO (V)
3.8 UVLO(LH) 3.6
3.4 UVLO(HL) 3.2
3.0 -20
0
20 40 Ambient Temperature TA (C)
60
80
Data Sheet S13020EJ1V0DS00
17
PD16855
MEASUREMENT CIRCUIT
5V 10 k 10 k 10 CTL1 FLG1 FLG2 CTL2 OUT1 IN 1 F GND 10 OUT2
PD16855
18
Data Sheet S13020EJ1V0DS00
PD16855
APPLICATION CIRCUIT
Example 1
5V D+ D- 10 k Over Current Enable
CTL1 OUT1 IN FLG1 FLG2 GND CTL2 OUT2
VBUS D+ D- GND 1F 150 F
PD16855A
USB Controller USB OUTPUT Port : 1 port Use PD16855A Not need to control by USB-controller (CTL-input is "H"-active)
Example 2
3.3 V D+ D- 10 k Over Current Enable 10 k
CTL1 OUT1 FLG1 IN FLG2 GND CTL2 OUT2
5V VBUS D+ D- GND 1 F 150 F 150 F VBUS D+ D- GND USB Connector
PD16855B
USB Controller
USB OUTPUT Port : 2 port Use PD16855B controllable by USB-controller (CTL-input is "L"-active)
Timing chart Example 2
5V IN (input) GND 5V OUT (output) Flg (output) GND 5V GND 5V CTL (input) GND
Iout
over current detect threshold
over current detect
The application circuits and their parameters are for references only and are not intended for use in actual designin's.
Data Sheet S13020EJ1V0DS00
19
PD16855
APPLICATION CIRCUIT
Example 3
5V D+ D- 10 k Over Current
CTL1 FLG1 FLG2 CTL2 OUT1 IN GND OUT2
VBUS D+ D- GND 1 F 150 F
PD16855C
USB Controller USB OUTPUT Port : 1 port Use PD16855C controllable by USB-controller
Example 4
3.3 V D+ D- 10 k Over Current 10 k
CTL1 OUT1 FLG1 IN FLG2 GND CTL2 OUT2
5V VBUS D+ D- GND 1F 150 F 150 F VBUS D+ D- GND USB Connector
PD16855D
USB Controller
USB OUTPUT Port : 2 port Use PD16855D Not need to control by USB-controller
Timing chart Example 4
5V IN (input) GND 5V OUT (output) Flg (output) GND 5V GND 5V CTL (input) GND
Iout
over current detect threshold
over current detect
The application circuits and their parameters are for references only and are not intended for use in actual designin's.
20
Data Sheet S13020EJ1V0DS00
PD16855
PACKAGE DRAWING
8 PIN PLASTIC DIP (300 mil)
8 5
1 10.16 MAX. 4.31 MAX.
4 7.62 0.9 MIN. 6.4
5.08 MAX.
0.51 MIN. 3.2 0.3 1.4 MIN. 0.50 0.10
2.54 1.27 MAX. 0.25 D0.05
+0.10
0~15
0.25
M
Data Sheet S13020EJ1V0DS00
21
PD16855
8 PIN PLASTIC SOP (225 mil)
8 5
1.8 MAX
1
1.44
4 5.37 MAX.
6.00.3 4.4 0.8
0.15 +0.10 -0.05
0.05 MIN.
0.50.2 0.10
1.27
0.78 MAX.
0.40 -0.05
+0.10
0.12 M
22
Data Sheet S13020EJ1V0DS00
PD16855
RECOMMENDED SOLDERING CONDITIONS
Soldering the PD16855 under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface Mount Type For the details of the recommended soldering conditions of the surface mount type, refer to information document "Semiconductor Device Mounting Technology MANUAL" (C10535E)
PD16855AG, PD16855BG, PD16855CG, PD16855DG
Soldering process Infrared ray reflow Soldering conditions Package peak temperature : 235 C, Time : 30 seconds MAX.(210 C MIN.), Number of times : 2 , Number of days : not limited* Package peak temperature : 215 C , Time : 40 seconds MAX.(200 C MIN.), Number of times : 2 , Number of days : not limited* Soldering bath temperature : 260 C MAX. , Time : 10 seconds MAX., Number of times : 1 , Number of days : not limited* Pin temperature : 300 C MAX. (lead temperature), Time : 3 seconds MAX. (per lead pin), Number of days : not limited* Symbol IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial heating method
* The number of days the devices can be stored at 25 C, 65 % RH MAX. after the dry pack has been opened. Caution Do not use two or more soldering methods in condition(except the pin partial heating method). Throught-hole Type
PD16855BC
Soldering process Wave soldering Soldering conditions Soldering bath temperature : 260 C MAX., Time : 10 seconds MAX. Symbol
REFERENCE
Document Name NEC semiconductor device reliability/quality control system Quality grade on NEC semiconductor devices Semiconductor device mounting technology manual NEC IC Package Manual (CD-ROM) Guide to quality assurance for semiconductor devices Semiconductor selection guide Document No. IEI-1212 C11531E C10535E C13388E MEI-1202 X10679E
Data Sheet S13020EJ1V0DS00
23
PD16855
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
24
Data Sheet S13020EJ1V0DS00
PD16855
[MEMO]
Data Sheet S13020EJ1V0DS00
25
PD16855
[MEMO]
26
Data Sheet S13020EJ1V0DS00
PD16855
[MEMO]
Data Sheet S13020EJ1V0DS00
27
PD16855
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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